Henkel Liquid Thermal Gap Filler Fuel Dispensing and Reduces Contamination Risk

High thermal conductivity controlled volatility material maximizes heat dissipation and alleviates outgassing concerns.

Bergquist Gap Filler

November 2020 – Bergquist Gap Filler TGF 4500CVO is a liquid, gap-filling thermal interface material that accelerates dispensing, reduces contamination risk, and improves reliability.

Bergquist Gap Filler TGF 4500CVO is a liquid, gap-filling thermal interface material that accelerates dispensing, reduces contamination risk, and improves reliability.

Recognizing the requirement in many market sectors for thermal interface materials (TIMs) that can enhance processability while complying with increasingly challenging performance and cost metrics, Henkel has leveraged a new formulation approach to develop Bergquist Gap Filler TGF 4500CVO. The liquid, gap-filling thermal interface material dramatically improves conventional TIM dispensing speeds while simultaneously delivering high thermal conductivity of 4.5 W/m-K in a controlled volatility product. Balancing viscosity, high thermal conductivity, and controlled volatile outgassing is a challenging formulation achievement. Still, Bergquist Gap Filler TGF 4500CVO successfully delivers these attributes in a material with low stress, silicone-like mechanical properties.

As Justin Kolbe, Henkel Director of Market Strategy for Power and Industrial Automation, notes, highly-filled, high thermal conductivity liquid TIMs have complex rheologies and are often challenging to dispense quickly. “Among other characteristics, Bergquist Gap Filler TGF 4500CVO resolves the dispensing rate dilemma with excellent processability, no separation, and good print fidelity,” he says, explaining that normally fast deposition or high thermal conductivity are binary formulation choices. “New Henkel resin and filler innovation have allowed an ‘all of the above scenario in a material that secures low cost of ownership alongside reduced siloxane contamination risk.”